화학공학소재연구정보센터
검색결과 : 117건
No. Article
1 The electrocatalysis of Mn-Co3O4/CeO2@C particles with different Ce content modified Ti/PbO2 anode and its application for copper electrodeposition
Zihang Yin, Ruibo He, Fei Nie, Zhen Wei, Bo Jia, Qing Feng, Xiaolong Fu, Wenyan Zhang
Korean Journal of Chemical Engineering, 40(12), 3059, 2023
2 Brightener breakdown at the insoluble anode by active chlorine species during Cu electrodeposition
Park DJ, Han MJ, Park MJ, Lee JY, Choe SH
Journal of Industrial and Engineering Chemistry, 106, 198, 2022
3 Molecular analysis of additives and impurities accumulated on copper electrodeposited layer by time-of-flight secondary ion mass spectrometry
Mroczka R, Lopucki R, Zukocinski G
Applied Surface Science, 463, 412, 2019
4 Solvent-dependent ultrasonic surface treatment on morphological reconstruction of CuO particles for copper electrodeposition
Chen YM, Yan D, Jin XF, Zeng Y, Zhang DM, Liu Z, He W, Wang SX, Wang Z, Liu YQ, Zhang WH, Huang YZ
Applied Surface Science, 491, 206, 2019
5 Enhanced activity for electrochemical hydrogenation and hydrogenolysis of furfural to biofuel using electrodeposited Cu catalysts
Jung S, Karaiskakis AN, Biddinger EJ
Catalysis Today, 323, 26, 2019
6 Working mechanism of iodide ions and its application to Cu microstructure control in through silicon via filling
Sung M, Kim SH, Lee HJ, Lim T, Kim JJ
Electrochimica Acta, 295, 224, 2019
7 Disposable electrochemical sensor based on copper-electrodeposited screen-printed gold electrode and its application in sensing L-Cysteine
Kurniawan A, Kurniawan F, Gunawan F, Chou SH, Wang MJ
Electrochimica Acta, 293, 318, 2019
8 Mass transfer and electrolyte flow during electrodeposition on a conically shaped electrode under the influence of a magnetic field
Huang M, Marinaro G, Yang X, Fritzsche B, Lei Z, Uhlemann M, Eckert K, Mutschke G
Journal of Electroanalytical Chemistry, 842, 203, 2019
9 Effects of 2-mercaptopyridine and Janus Green B as levelers on electrical resistance of electrodeposited copper thin film for interconnects
Zhang YM, Hang T, Dong MY, Wu YW, Ling HQ, Hu AM, Li M
Thin Solid Films, 677, 39, 2019
10 DFT study of interaction of additives with Cu(111) surface relevant to Cu electrodeposition
Dianat A, Yang HL, Bobeth M, Cuniberti G
Journal of Applied Electrochemistry, 48(2), 211, 2018