화학공학소재연구정보센터
검색결과 : 4건
No. Article
1 Stress relaxation during bond formation and adhesion of pressure-sensitive adhesives
Novikov MB, Gdalin BE, Anosova JV, Feldstein MM
Journal of Adhesion, 84(2), 164, 2008
2 Mechanics of Adhesively Bonded Flip-Chip-on-Flex Assemblies. Part I: Durability of Anisotropically Conductive Adhesive Interconnects
Haase J, Farley D, Iyer P, Baumgartner P, Dasgupta A, Caers JFJ
Journal of Adhesion Science and Technology, 22(14), 1733, 2008
3 The interrelationships between electronically conductive adhesive formulations, substrate and filler surface properties, and joint performance. Part I: the effects of adhesive thickness
Gomatam RR, Sancaktar E
Journal of Adhesion Science and Technology, 18(11), 1225, 2004
4 The interrelationships between electronically conductive adhesive formulations, substrate and filler surface properties, and joint performance. Part II: the effects of bonding pressure
Gomatam RR, Sancaktar E
Journal of Adhesion Science and Technology, 18(11), 1245, 2004