검색결과 : 1건
No. | Article |
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1 |
De-bondable SiC-SiC wafer bonding via an intermediate Ni nano-film Mu FW, Uomoto M, Shimatsu T, Wang YH, Iguchi K, Nakazawa H, Takahashi Y, Higurashi E, Suga T Applied Surface Science, 465, 591, 2019 |
No. | Article |
---|---|
1 |
De-bondable SiC-SiC wafer bonding via an intermediate Ni nano-film Mu FW, Uomoto M, Shimatsu T, Wang YH, Iguchi K, Nakazawa H, Takahashi Y, Higurashi E, Suga T Applied Surface Science, 465, 591, 2019 |