화학공학소재연구정보센터
검색결과 : 6건
No. Article
1 Characteristics of End-of-Life Printed Wiring Boards Processed by Electrodynamic Fragmentation
Martino R, Iseli C, Gaydardzhiev S, Streicher-Porte M, Weh A
Chemie Ingenieur Technik, 89(1-2), 152, 2017
2 Electro dynamic fragmentation of printed wiring boards as a preparation crossMark tool for their recycling
Martino R, Iseli C, Gaydardzhiev S, Streicher-Porte M, Weh A
Minerals Engineering, 107, 20, 2017
3 Environmental and risk screening for prioritizing pollution prevention opportunities in the US printed wiring board manufacturing industry
Lam CW, Lim SR, Schoenung JM
Journal of Hazardous Materials, 189(1-2), 315, 2011
4 Novel materials for electronic device fabrication using ink-jet printing technology
Kumashiro Y, Nakako H, Inada M, Yamamoto K, Izumi A, Ishihara M
Applied Surface Science, 256(4), 1019, 2009
5 A highly stabilized-inhibited nitric acid/ferric nitrate-based solder stripping solution
Shaigan N, Ashrafizadeh SN
Journal of Applied Electrochemistry, 36(9), 1043, 2006
6 Investigation of the curing behavior of a novel epoxy photo-dielectric dry film (ViaLux (TM) 81) for high density interconnect applications
Dunne RC, Sitaraman SK, Luo SJ, Rao Y, Wong CP, Estes WE, Gonzalez CG, Coburn JC, Periyasamy M
Journal of Applied Polymer Science, 78(2), 430, 2000