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Characteristics of End-of-Life Printed Wiring Boards Processed by Electrodynamic Fragmentation Martino R, Iseli C, Gaydardzhiev S, Streicher-Porte M, Weh A Chemie Ingenieur Technik, 89(1-2), 152, 2017 |
2 |
Electro dynamic fragmentation of printed wiring boards as a preparation crossMark tool for their recycling Martino R, Iseli C, Gaydardzhiev S, Streicher-Porte M, Weh A Minerals Engineering, 107, 20, 2017 |
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Environmental and risk screening for prioritizing pollution prevention opportunities in the US printed wiring board manufacturing industry Lam CW, Lim SR, Schoenung JM Journal of Hazardous Materials, 189(1-2), 315, 2011 |
4 |
Novel materials for electronic device fabrication using ink-jet printing technology Kumashiro Y, Nakako H, Inada M, Yamamoto K, Izumi A, Ishihara M Applied Surface Science, 256(4), 1019, 2009 |
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A highly stabilized-inhibited nitric acid/ferric nitrate-based solder stripping solution Shaigan N, Ashrafizadeh SN Journal of Applied Electrochemistry, 36(9), 1043, 2006 |
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Investigation of the curing behavior of a novel epoxy photo-dielectric dry film (ViaLux (TM) 81) for high density interconnect applications Dunne RC, Sitaraman SK, Luo SJ, Rao Y, Wong CP, Estes WE, Gonzalez CG, Coburn JC, Periyasamy M Journal of Applied Polymer Science, 78(2), 430, 2000 |