화학공학소재연구정보센터
검색결과 : 3건
No. Article
1 Bottom-Up Copper Filling of Millimeter Size Through Silicon Vias
Josell D, Menk LA, Hollowell AE, Blain M, Moffat TP
Journal of the Electrochemical Society, 166(1), D3254, 2019
2 Bottom-Up Copper Filling of Large Scale Through Silicon Vias for MEMS Technology
Menk LA, Josell D, Moffat TP, Baca E, Blain MG, Smith A, Dominguez J, McClain J, Yeh PD, Hollowell AE
Journal of the Electrochemical Society, 166(1), D3066, 2018
3 Galvanostatic Plating with a Single Additive Electrolyte for Bottom-Up Filling of Copper in Mesoscale TSVs
Menk LA, Baca E, Blain MG, McClain J, Dominguez J, Smith A, Hollowell AE
Journal of the Electrochemical Society, 166(1), D3226, 2018