화학공학소재연구정보센터
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No. Article
1 Bottom-Up Copper Filling of Millimeter Size Through Silicon Vias
Josell D, Menk LA, Hollowell AE, Blain M, Moffat TP
Journal of the Electrochemical Society, 166(1), D3254, 2019
2 Effect of Chloride Concentration on Copper Deposition in Through Silicon Vias
Braun TM, Josell D, Silva M, Kildon J, Moffat TP
Journal of the Electrochemical Society, 166(1), D3259, 2019
3 Accelerated Bottom-Up Gold Filling of Metallized Trenches
Josell D, Williams ME, Ambrozik S, Zhang C, Moffat TP
Journal of the Electrochemical Society, 166(12), D487, 2019
4 Exploring the Limits of Bottom-Up Gold Filling to Fabricate Diffraction Gratings
Josell D, Ambrozik S, Williams ME, Hollowell AE, Arrington C, Muramoto S, Moffat TP
Journal of the Electrochemical Society, 166(16), D898, 2019
5 Superconformal Copper Deposition in Through Silicon Vias by Suppression-Breakdown
Josell D, Moffat TP
Journal of the Electrochemical Society, 165(2), D23, 2018
6 Bottom-Up Copper Filling of Large Scale Through Silicon Vias for MEMS Technology
Menk LA, Josell D, Moffat TP, Baca E, Blain MG, Smith A, Dominguez J, McClain J, Yeh PD, Hollowell AE
Journal of the Electrochemical Society, 166(1), D3066, 2018
7 Bottom-up Filling of Damascene Trenches with Gold in a Sulfite Electrolyte
Josell D, Moffat TP
Journal of the Electrochemical Society, 166(1), D3022, 2018
8 Superconformal Nickel Deposition in Through Silicon Vias: Experiment and Prediction (vol 165, pg D23, 2018)
Braun TM, Kim SH, Lee HJ, Moffat TP, Josell D
Journal of the Electrochemical Society, 165(11), X11, 2018
9 Superconformal Nickel Deposition in Through Silicon Vias: Experiment and Prediction
Braun TM, Kim SH, Lee HJ, Moffat TP, Josell D
Journal of the Electrochemical Society, 165(7), D291, 2018
10 Superconformal Bottom-Up Gold Deposition in High Aspect Ratio Through Silicon Vias
Josell D, Moffat TP
Journal of the Electrochemical Society, 164(6), D327, 2017