| 1 |
Approach the powder contact force, voidage, tensile stress, wall frictional stress and state diagram of powder bed by simple pressure drop monitoring
Hsu WY, Huang AN, Kuo HP
Advanced Powder Technology, 31(1), 433, 2020 |
| 2 |
Stage-wise characterization of the high shear granulation process by impeller torque changing rate
Lin CY, Wang HC, Hsu WY, Huang AN, Kuo HP
Advanced Powder Technology, 30(8), 1513, 2019 |
| 3 |
Analysis of interparticle forces and particle-wall interactions by powder bed pressure drops at incipient fluidization
Hsu WY, Huang AN, Kuo HP
Powder Technology, 325, 64, 2018 |
| 4 |
Photocatalytic degradation of toluene in a staged fluidized bed reactor using TiO2/silica gel
Kuo HP, Yao SW, Huang AN, Hsu WY
Korean Journal of Chemical Engineering, 34(1), 73, 2017 |
| 5 |
Sol-gel derived ZnO-CeO2 thin films on glass substrate
Tseng CF, Hsu WY
Thin Solid Films, 544, 44, 2013 |
| 6 |
Evolvement of cell-substrate interaction over time for cells cultivated on a 3-aminopropyltriethoxysilane (gamma-APTES) modified silicon dioxide (SiO2) surface
Hsu CP, Hsu PY, Wu YL, Hsu WY, Lin JJ
Applied Surface Science, 258(22), 8641, 2012 |
| 7 |
Simultaneous determination of components released from dental composite resins in human saliva by liquid chromatography/multiple-stage ion trap mass spectrometry
Hsu WY, Wang VS, Lai CC, Tsai FJ
Electrophoresis, 33(4), 719, 2012 |
| 8 |
Stress Gradient Modification of the Electroplated Ni-Diamond Nanocomposite for MEMS Fabrication
Lee YC, Cheng YT, Hsu WY
Journal of the Electrochemical Society, 159(4), H460, 2012 |
| 9 |
Cu planarization in electrochemical mechanical planarization
Liu FQ, Du TB, Duboust A, Tsai S, Hsu WY
Journal of the Electrochemical Society, 153(6), C377, 2006 |
| 10 |
Experimental and theoretical studies of metal cation-pyridine complexes containing Cu and Ag
Yang YS, Hsu WY, Lee HF, Huang YC, Yeh CS, Hu CH
Journal of Physical Chemistry A, 103(51), 11287, 1999 |
