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플래시라이트를 이용한 금속나노입자 기반 전극 및 금속유기골격체 합성 전략 임창용, 백새연, 박소연, 김하민 Applied Chemistry for Engineering, 31(6), 591, 2020 |
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Comparison of electrochromic characteristics of electrochromic device upon various sintering methods of sol-gel based WO3 electrode Kim H, Son M, Ahn SH, Lee CS Current Applied Physics, 20(6), 782, 2020 |
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Enhancing adhesion properties between binder-free copper nanoink and flexible substrate using chemically generated interlocking structure Cho CH, Shin IK, Kim KY, Choi YJ Applied Surface Science, 485, 484, 2019 |
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A study on the relationship between print-ability and flash light sinter-ability of Cu nano/micro-ink for printed electronics Ryu CH, Moon CJ, Kim HS Thin Solid Films, 671, 36, 2019 |
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Application of flash-light sintering method to flexible inkjet printing using anti-oxidant copper nanoparticles Son YH, Jang JY, Kang MK, Ahn S, Lee CS Thin Solid Films, 656, 61, 2018 |
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Flash light sintering of ag mesh films for printed transparent conducting electrode Moon CJ, Kim I, Joo SJ, Chung WH, Lee TM, Kim HS Thin Solid Films, 629, 60, 2017 |
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Two-step flash light sintering of copper nanoparticle ink to remove substrate warping Ryu CH, Joo SJ, Kim HS Applied Surface Science, 384, 182, 2016 |
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Two-step flash light sintering process for enhanced adhesion between copper complex ion/silane ink and a flexible substrate Jeon EB, Joo SJ, Ahn H, Kim HS Thin Solid Films, 603, 382, 2016 |
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Flash light sintering of nickel nanoparticles for printed electronics Park SH, Kim HS Thin Solid Films, 550, 575, 2014 |
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The effect of poly (N-vinylpyrrolidone) molecular weight on flash light sintering of copper nanopaste Kim YJ, Ryu CH, Park SH, Kim HS Thin Solid Films, 570, 114, 2014 |