| 1 |
Analysis of crack-free surface generation of photovoltaic polysilicon wafer cut by diamond wire saw
Yin YK, Gao YF, Wang LY, Zhang L, Pu TZ
Solar Energy, 216, 245, 2021 |
| 2 |
Improvement of saw damage removal to fabricate uniform black silicon nanostructure on large-area multi-crystalline silicon wafers
Li XP, Tao K, Ge HY, Zhang DN, Gao ZB, Jia R, Chen SD, Ji ZY, Jin Z, Liu XY
Solar Energy, 204, 577, 2020 |
| 3 |
Kinetic mechanism of aluminum removal from diamond wire saw powder in HCl solution
Yang SC, Wei KX, Ma WH, Xie KQ, Wu JJ, Lei Y
Journal of Hazardous Materials, 368, 1, 2019 |
| 4 |
Study on the kinetics of iron removal from silicon diamond-wire saw cutting waste: Comparison between heterogeneous and homogeneous reaction methods
Kong J, Jin X, Liu Y, Wei DH, Jiang SN, Gao SB, Feng ZB, Xing PF, Luo XT
Separation and Purification Technology, 221, 261, 2019 |
| 5 |
Fracture strength of silicon wafers sawn by fixed diamond wire saw
Liu TY, Ge PQ, Bi WB, Wang PZ
Solar Energy, 157, 427, 2017 |
| 6 |
The experiment research of diamond wire-saw in quarrying granite with high efficiency
Zhang JS, Huang B, Wang Z, Wang XL, Liu ZW
Materials Science Forum, 471-472, 117, 2004 |
| 7 |
Development of endless diamond wire saw and sawing experiments
Ge PQ, Zhang L, Gao W, Liu ZC
Materials Science Forum, 471-472, 481, 2004 |
