검색결과 : 8건
No. | Article |
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1 |
Electrochemical synthesis and photoelectrochemical characterization of copper hexacyanoferrate (II) deposited on n-Si(100) Cisternas R, Cordova RA, Henriquez RG, Schrebler RS, Munoz EC Journal of Electroanalytical Chemistry, 741, 120, 2015 |
2 |
The effect of inducing uniform Cu growth on formation of electroless Cu seed layer Lim T, Kim MJ, Park KJ, Kim KH, Choe S, Lee YS, Kim JJ Thin Solid Films, 564, 299, 2014 |
3 |
Selective Electroless Copper Plating on Poly(ethylene terephthalate) Surfaces by Microcontact Printing Huang SC, Tsao TC, Chen LJ Journal of the Electrochemical Society, 157(4), D222, 2010 |
4 |
Effect of Organosilane Underlayers on the Effectiveness of NiB Barrier Layers in ULSI Metallization Yoshino M, Aramaki H, Matsuda I, Okinaka Y, Osaka T Electrochemical and Solid State Letters, 12(4), D19, 2009 |
5 |
Electroless copper on refractory and noble metal substrates with an ultra-thin plasma-assisted atomic layer deposited palladium layer Kim YS, Kim HI, Cho JH, Seo HK, Dar MA, Shin HS, Ten Eyck GA, Lu TM, Senkevich JJ Electrochimica Acta, 51(12), 2400, 2006 |
6 |
Obtaining of high surface roughness copper deposits by electroless plating technique Norkus E, Vaskelis A, Jaciauskiene J, Stalnioniene I, Stalnionis G Electrochimica Acta, 51(17), 3495, 2006 |
7 |
Improvement of silicon powder negative electrodes by copper electroless deposition for lithium secondary batteries Kim JW, Ryu JH, Lee KT, Oh SM Journal of Power Sources, 147(1-2), 227, 2005 |
8 |
텅스텐 기판 위에 구리 무전해 도금에 대한 연구 김영순, 신지호, 김형일, 조중희, 서형기, 김길성, 신형식 Korean Chemical Engineering Research, 43(4), 495, 2005 |