화학공학소재연구정보센터
검색결과 : 29건
No. Article
1 Area-Selective Atomic Layer Deposition of TiN Using Trimethoxy(octadecyl)silane as a Passivation Layer
Zheng L, He W, Spampinato V, Franquet A, Sergeant S, De Gendt S, Armini S
Langmuir, 36(44), 13144, 2020
2 Area selective grafting of siloxane molecules on low-k dielectric with respect to copper surface
Rezvanov A, Gornev ES, de Marneffe JF, Armini S
Applied Surface Science, 476, 317, 2019
3 Self-focusing SIMS: A metrology solution to area selective deposition
Spampinato V, Armini S, Franquet A, Cunard T, van der Heide P, Vandervorst W
Applied Surface Science, 476, 594, 2019
4 Metal barrier induced damage in self-assembly based organosilica low-k dielectrics and its reduction by organic template residues
Krishtab M, De Marneffe JF, Armini S, Meersschaut J, Benders H, Wilson C, De Gendt S
Applied Surface Science, 485, 170, 2019
5 On the use of (3-trimethoxysilylpropyl) diethylenetriamine self-assembled monolayers as seed layers for the growth of Mn based copper diffusion barrier layers
Brady-Boyd A, O'Connor R, Armini S, Selvaraju V, Hughes G, Bogan J
Applied Surface Science, 427, 260, 2018
6 Nucleation and adhesion of ultra-thin copper films on amino-terminated self-assembled monolayers
Bogan J, Brady-Boyd A, Armini S, Lundy R, Selvaraju V, O'Connor R
Applied Surface Science, 462, 38, 2018
7 Surface sealing using self-assembled monolayers and its effect on metal diffusion in porous low-k dielectrics studied usingmonoenergetic positron beams
Uedono A, Armini S, Zhang Y, Kakizaki T, Krause-Rehberg R, Anwand W, Wagner A
Applied Surface Science, 368, 272, 2016
8 Wafer Scale Copper Direct Plating on Thin PVD RuTa Layers: A Route to Enable Filling 30 nm Features and Below?
Armini S, El-Mekki Z, Nagar M, Radisic A, Vereecken PM
Journal of the Electrochemical Society, 161(10), D564, 2014
9 Nucleation Kinetics of Electroless Cu Deposition on Ruthenium Using Glyoxylic Acid as a Reducing Agent
Inoue F, Philipsen H, van der Veen MH, Van Huylenbroeck S, Armini S, Struyf H, Tanaka T
Journal of the Electrochemical Society, 161(14), D768, 2014
10 Impact of Plasma Pretreatment and Pore Size on the Sealing of Ultra-Low-k Dielectrics by Self-Assembled Monolayers
Sun YT, Krishtab M, Struyf H, Verdonck P, De Feyter S, Baklanov MR, Armini S
Langmuir, 30(13), 3832, 2014