TY - JOUR PY - 2012 J2 - J. Electrochem. Soc. SN - 0013-4651 T2 - Journal of the Electrochemical Society VL - 159 IS - 6 DO - 10.1149/2.097206jes TI - Vapor Deposition of Highly Conformal Copper Seed Layers for Plating Through-Silicon Vias (TSVs) UR - https://www.cheric.org/research/tech/periodicals/view.php?seq=953241 AU - Au Y AU - Wang QM AU - Li HZ AU - Lehn JSM AU - Shenai DV AU - Gordon RG SP - D382 EP - D385 LA - English ER -