TY - JOUR PY - 2007 J2 - Thermochim. Acta SN - 0040-6031 T2 - Thermochimica Acta VL - 455 IS - 1-2 DO - 10.1016/j.tca.2006.11.034 TI - Thermal characterization of thermally conductive underfill for a flip-chip package using novel temperature sensing technique UR - https://www.cheric.org/research/tech/periodicals/view.php?seq=586242 KW - flip-chip package KW - underfill KW - diode temperature sensor array KW - diamond AU - Lee WS AU - Han IY AU - Yu J AU - Kim SJ AU - Byun KY SP - 148 EP - 155 LA - Multi-Language ER -