TY - JOUR PY - 2000 J2 - J. Vac. Sci. Technol. A SN - 0734-2101 T2 - Journal of Vacuum Science & Technology A VL - 18 IS - 5 TI - Copper electroplating for future ultralarge scale integration interconnection (vol 18, pg 656, 2000) UR - https://www.cheric.org/research/tech/periodicals/view.php?seq=340761 AU - Gau WC AU - Chang TC AU - Lin YS AU - Hu JC AU - Chen LJ AU - Chang CY AU - Cheng CL SP - 2597 EP - 2597 LA - English ER -