TY - JOUR PY - 2022 J2 - J. Ind. Eng. Chem. SN - 1226-086X T2 - Journal of Industrial and Engineering Chemistry VL - 112 DO - 10.1016/j.jiec.2022.05.026 TI - Formation of a robust Cu adhesive layer on poly(ether ether ketone) via self UV-initiated surface polymerization UR - https://www.cheric.org/research/tech/periodicals/view.php?seq=1861576 KW - Poly(ether ether ketone) KW - Surface modification KW - Photopolymerization KW - Cu adhesion KW - Dielectrics KW - Bonding sheet-free AU - Hur J AU - Lee JB AU - Kim BY AU - Yoo MJ AU - Seo JH SP - 307 EP - 315 LA - English ER -