TY - JOUR PY - 2021 J2 - J. Mater. Sci. SN - 0022-2461 T2 - Journal of Materials Science VL - 56 IS - 7 DO - 10.1007/s10853-020-05586-3 TI - The reduction of thermal conductivity in Cd and Sn co-doped Cu3SbSe4-based composites with a secondary-phase CdSe UR - https://www.cheric.org/research/tech/periodicals/view.php?seq=1841213 AU - Deng SP AU - Jiang XY AU - Chen LL AU - Zhang ZY AU - Qi N AU - Wu YC AU - Chen ZQ AU - Tang XF SP - 4727 EP - 4740 LA - English ER -