TY - JOUR PY - 2019 J2 - Appl. Surf. Sci. SN - 0169-4332 T2 - Applied Surface Science VL - 490 DO - 10.1016/j.apsusc.2019.06.105 TI - An explanation of sintered silver bonding formation on bare copper substrate in air UR - https://www.cheric.org/research/tech/periodicals/view.php?seq=1738901 KW - Sintered silver film KW - Bare copper substrate KW - Oxide layer KW - Ag-Cu2O bond KW - Ag aggregation AU - Du CJ AU - Li X AU - Mei YH AU - Lu GQ SP - 403 EP - 410 LA - English ER -