TY - JOUR PY - 2019 J2 - Thermochim. Acta SN - 0040-6031 T2 - Thermochimica Acta VL - 672 DO - 10.1016/j.tca.2018.12.016 TI - Optimizing curing process of graphene oxide/waterborne epoxy blends by curing kinetics simulation considering the coupling of heat conduction and curing reaction UR - https://www.cheric.org/research/tech/periodicals/view.php?seq=1716069 KW - Graphene oxide / waterborne epoxy KW - Non-isothermal differential scanning calorimetry KW - Curing kinetics KW - Thermal shock KW - Simulation AU - Wang ZW AU - Liu LJ AU - Zhang J AU - Cao LY AU - Dong HX AU - Zhang CH AU - Xu X AU - Zhu MX AU - Li JQ SP - 60 EP - 69 LA - Multi-Language ER -