화학공학소재연구정보센터
Clean Technology, Vol.22, No.4, 274-280, December, 2016
태양광용 웨이퍼 실리콘 폐슬러지로부터 절삭유의 재생
Recycling of Cutting Oil from Silicon Waste Sludge of Solar Wafer
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초록
본 연구에서는 태양광용 웨이퍼를 제조하는 과정에서 발생하는 실리콘 폐슬러지의 함유물질 중 공정원가의 25% 가량을 차지하고 있는 절삭유를 화학적으로 재생하기 위한 방법을 개발하고자 하였다. 이를 위해 아세톤, HCl, NaOH, KOH, Na2CO3, 불산, 염화메틸렌 등 7종류의 시약이 이용되었으며 다양한 농도로 폐슬러지와 반응을 실시하고 3000 rpm의 속도로 60분간 원심분리를 수행하였다. 그 결과, 실리콘분말 및 금속분말과 같은 고형물과 액상의 절삭유를 분리하기 위한 최적 시약 및 조건이 0.3 N NaOH로 확인되었다. 시판되는 절삭유의 약산성 특성에 맞게 pH 조절이 요구되어 금속분말 제거에 효과적인 0.1 N HCl과 폐슬러지를 먼저 반응시킨 후 0.3 N NaOH로 후처리 한 재생 절삭유의 pH가 6.05로 나타났으며 0.3 N NaOH 단독으로 폐슬러지에 적용하였을 때 보다 우수한 탁도를 나타내었다. 시판용 절삭유와의 특성을 비교하고자 FT-IR 분석을 실시한 결과, 재생유로서의 가능성이 확인되었으며 실험을 통하여 얻어진 절삭유 회수율은 86.9%로 나타났다.
In this study, it was to develop a chemical method that can recycle the cutting oil which accounts for about 25% of the cost of the process among containing materials of silicon waste sludge generated in the process for producing a solar cell wafer. The 7 types of reagents have been used, including acetone, HCl, NaOH, KOH, Na2CO3, HF, CH2Cl2, etc. for this experiment. And It was carried out at a speed of 3000 rpm for 60 minutes centrifugation after performing a reaction with a waste sludge at various concentrations. As a result, the best reagents and conditions for separating the solid such as a silicon powder and a metal powder and liquid cutting oil were identified as 0.3 N NaOH. It is found to be pH 6.05 in a post-processing recycled cutting oil with 0.3 N NaOH after reaction of waste sludge and 0.1 N HCl which is effective to remove metal powder in order to adjust the pH to suit the properties of the weak acid is a commercially available cutting oil and it showed excellent turbidity than when applied to sludge with 0.3 N NaOH alone. The results of FT-IR analysis which can compare the properties of the commercially available cutting oil shows it has a possibility of recycling oil. The cutting oil recovery rate obtained through the experiment was found to be 86.9%.
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